Qualcomm Partners With BOE To Bring 3D Sonic In-display Sensors To More Smartphones

US-based mobile chip maker Qualcomm has announced a partnership with Chinese company, BOE Technology Group Co., Ltd., the world’s largest display maker, that will see more OEMs incorporate Qualcomm’s 3D Sonic ultrasonic in-display fingerprint sensors to their smartphones.

This partnership will prove beneficial to more adoption of Qualcomm’s 3D ultrasonic fingerprint sensor which has, to date, been seen in few, and specifically, high-end premium smartphones. So far, only Samsung has been able to integrate 3D sonic sensors to a handful of smartphones like the Galaxy S10 and S20 series.

Additionally, Qualcomm says the collaboration will extend to other technologies as well, including XR and IoT, apart from mobile and associated 5G technologies.

The two companies will bring together their various expertise which is touted to prove handy for the 5G era.

“Integrating Qualcomm 3D Sonic sensors onto BOE’s flexible OLED displays is intended to bring a more streamlined solution, which can enable smartphone OEMs to create unique products using the industry’s thinnest and highest security fingerprint solution,” Qualcomm said in a statement.

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